LinxiCore
「LinxiCore」对应一条老挝商标公开记录,由 Huawei Technologies Co., Ltd. 于 2024-04-08 提交申请,当前状态为已注册。公开档案中可核验:申请号 M/1789354,注册/授权号 62976,DIP 编号 LAM1789354,主管局代码 LA,申请类型 Other。时间线要点:公开/公告日 2024-05-17;注册日 2025-02-25。尼斯分类覆盖第 9、42 类。商品与服务说明摘录:Multiprocessor chips; semi-conductor chips; chips [integrated circuits]; microchips; semi-conductors; semi-co…。代理机构 / 代理人记载为 Chofn Intellectual Property。以上文字由独有申请标识与状态字段拼接而成,供检索与尽调线索使用;状态可能随 DIP 更新变化,请以主管部门最新数据为准。
This Laos trademark “LinxiCore” is a public DIP intellectual-property record, filed by Huawei Technologies Co., Ltd. on 2024-04-08; current status: Registered. Identifiers include application No. M/1789354; registration/grant No. 62976; DIP id LAM1789354; application type Other. Key dates: publication 2024-05-17; registration 2025-02-25. Nice class(es): 9、42. Goods/services excerpt: Multiprocessor chips; semi-conductor chips; chips [integrated circuits]; microchips; semi-conductors; semi-co…. Status labels may change after office actions; refresh or consult primary DIP data before commercial decisions.
ເຄື່ອງໝາຍການຄ້າ «LinxiCore» ເປັນຂໍ້ມູນຊັບສິນທາງປັນຍາເປີດເຜີຍຂອງ DIP, ຍື່ນໂດຍ Huawei Technologies Co., Ltd. ໃນວັນທີ 2024-04-08; ສະຖານະ ຈົດທະບຽນແລ້ວ. ຕົວລະບຸ: ເລກທີຄຳຮ້ອງ M/1789354; ເລກທະບຽນ 62976; ລະຫັດ DIP LAM1789354. ວັນທີສຳຄັນ: ວັນເຜີຍແຜ່ 2024-05-17; ວັນຈົດທະບຽນ/ອະນຸຍາດ 2025-02-25. ປະເພດ/ຫ້ອງ: 9、42. ສິນຄ້າ/ບໍລິການ: Multiprocessor chips; semi-conductor chips; chips [integrated circuits]; microchips; semi-conductors; semi-co…. ໃຊ້ LaoBiz ເພື່ອເບິ່ງ IP ອື່ນຂອງຜູ້ຍື່ນຄົນດຽວ ຫຼື ໜ້າວິສາຫະກິດທີ່ກ່ຽວຂ້ອງ.
M/1789354
图样
基础信息
- 类型
- 商标
- 申请号
M/1789354- 状态
- 已注册
- 申请人
- Huawei Technologies Co., Ltd.
- 代理机构
- Chofn Intellectual Property
- 申请日期
- 2024-04-08
- 注册号
62976- 公开/公告日
- 2024-05-17
- 注册/授权日
- 2025-02-25
- 国际分类
- 9 · 42
- 商品 / 服务
- Multiprocessor chips; semi-conductor chips; chips [integrated circuits]; microchips; semi-conductors; semi-conductor devices; sensors; routers; digital sound processors; video processors; central processing units [processors]; graphics processor units [GPUs]; data processors.
- Design of semiconductors; design of integrated circuits; research in the field of artificial intelligence technology; technological research; cloud computing; platform as a service [PaaS]; software as a service [SaaS]; writing of data processing programs; providing search engines for the internet; design and development of computer software.
办理流程
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