LinxiCore
This Laos Trademark “LinxiCore” is a public DIP intellectual-property record, filed by Huawei Technologies Co., Ltd. on 2024-04-08; current status: Registered. Identifiers include application No. M/1789354; registration/grant No. 62976; DIP id LAM1789354; application type Other. Key dates: publication 2024-05-17; registration 2025-02-25. Nice class(es): 9、42. Goods/services excerpt: Multiprocessor chips; semi-conductor chips; chips [integrated circuits]; microchips; semi-conductors; semi-co…. Status labels may change after office actions; refresh or consult primary DIP data before commercial decisions.
M/1789354
Mark
Key facts
- Type
- Trademark
- App. no.
M/1789354- Status
- Registered
- Applicant
- Huawei Technologies Co., Ltd.
- Agent
- Chofn Intellectual Property
- Filing date
- 2024-04-08
- Reg. no.
62976- Publication
- 2024-05-17
- Registration / grant
- 2025-02-25
- Nice / IPC classes
- 9 · 42
- Goods / services
-
- Multiprocessor chips; semi-conductor chips; chips [integrated circuits]; microchips; semi-conductors; semi-conductor devices; sensors; routers; digital sound processors; video processors; central processing units [processors]; graphics processor units [GPUs]; data processors.
- Design of semiconductors; design of integrated circuits; research in the field of artificial intelligence technology; technological research; cloud computing; platform as a service [PaaS]; software as a service [SaaS]; writing of data processing programs; providing search engines for the internet; design and development of computer software.
Process
Steps follow the current public status-
Filed
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Formal examination
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Substantive examination
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Gazetted
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Registered
Related records
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