CONTROL SYSTEM FOR DOUBLE-SIDE POLISHING APPARATUS, CONTROL APPARATUS, AND METHOD FOR PRODUCING SUBSTRATE
The following summary describes a Laos Patent titled “CONTROL SYSTEM FOR DOUBLE-SIDE POLISHING APPARATUS, CONTROL APPARATUS, AND METHOD FOR PRODUCING SUBSTRATE”, filed by TOYO KOHAN CO., LTD on 2020-07-03; current status: Registered. Identifiers include application No. P/818; DIP id LAP818; protection kind Patent - PCT National Phase. Key dates: publication 2025-12-19; grant 2025-04-25; expiry reference 2040-07-03. Classification: B24B 37/08、B24B 49/10、B24B 49/16、H01L 21/304. Inventor(s)/designer(s): FUJII Hirofumi, KITAMOTO Hideo, SHIOMICHI Yukimasa, SUGIMURA OsaMU. Abstract hint: The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a metho…. This prose is informational only and does not constitute legal advice, ownership proof or an infringement opinion.
P/818
Mark
Key facts
- Type
- Patent
- App. no.
P/818- Status
- Registered
- Applicant
- TOYO KOHAN CO., LTD
- Agent
- Tilleke & Gibbins Lao Co., Ltd
- Filing date
- 2020-07-03
- Reg. no.
P/818- Publication
- 2025-12-19
- Registration / grant
- 2025-04-25
- Expiry
- 2040-07-03
- Protection kind
- Patent - PCT National Phase
- Gazette
- 301 · 2025-04-25
- Priority
- JP · 2019-124851 · 2019-07-03
- Applicant address
- TOYO KOHAN CO., LTD · 18-1, Higashi-Gotanda 2 Chome, Shinagawa-ku, Tokyo 1418260 JAPAN · JP
- Agent address
- Tilleke & Gibbins Lao Co., Ltd · No. 302, 3rd Floor, Vieng Vang Tower, Unit 15, Boulichan Road, Dongpalan Thong Village, Sisattanak District, Vientiane Capital, Lao PDR · LA
- Nice / IPC classes
- B24B 37/08 · B24B 49/10 · B24B 49/16 · H01L 21/304
- Goods / services
- —
Process
Steps follow the current public status-
Filed
-
Formal examination
-
Substantive examination
-
Published
-
Granted
Related records
Linked from the LaoBiz.com company databaseSimilar Patent
Abstract
The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a method for producing a substrate with which it is possible to quickly control the flatness of a substrate with a high degree of precision by controlling polishing conditions. The present invention is a control system of a double-sided polishing device 10 that sandwiches a body W to be polished between an upper face plate 21 and a lower face plate 32 and that polishes a TOP surface 30a and a BOT surface 30b of the body W to be polished by causing the upper face plate and the lower face plate to rotate, wherein the control system is characterized in that: each of a TOP surface work amount PT (Ws) required in polishing of the TOP surface 30a, and a BOT surface work amount PB (Ws) required in polishing of the BOT surface 30b, are calculated; and polishing conditions are controlled so that the difference between the calculated TOP surface work amount PT and BOT surface work amount PB is kept within a prescribed range.
The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a method for producing a substrate with which it is possible to quickly control the flatness of a substrate with a high degree of precision by controlling polishing conditions. The present invention is a control system of a double-sided polishing device 10 that sandwiches a body W to be polished between an upper face plate 21 and a lower face plate 32 and that polishes a TOP surface 30a and a BOT surface 30b of the body W to be polished by causing the upper face plate and the lower face plate to rotate, wherein the control system is characterized in that: each of a TOP surface work amount PT (Ws) required in polishing of the TOP surface 30a, and a BOT surface work amount PB (Ws) required in polishing of the BOT surface 30b, are calculated; and polishing conditions are controlled so that the difference between the calculated TOP surface work amount PT and BOT surface work amount PB is kept within a prescribed range.
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