专利 已注册

CONTROL SYSTEM FOR DOUBLE-SIDE POLISHING APPARATUS, CONTROL APPARATUS, AND METHOD FOR PRODUCING SUBSTRATE

Overview

ໜ້ານີ້ສະຫຼຸບ ສິດທິບັດ «CONTROL SYSTEM FOR DOUBLE-SIDE POLISHING APPARATUS, CONTROL APPARATUS, AND METHOD FOR PRODUCING SUBSTRATE» ຈາກຂໍ້ມູນຈົດທະບຽນເປີດ, ຍື່ນໂດຍ TOYO KOHAN CO., LTD ໃນວັນທີ 2020-07-03; ສະຖານະ ຈົດທະບຽນແລ້ວ. ຕົວລະບຸ: ເລກທີຄຳຮ້ອງ P/818; ລະຫັດ DIP LAP818; ປະເພດການປົກປ້ອງ Patent - PCT National Phase. ວັນທີສຳຄັນ: ວັນເຜີຍແຜ່ 2025-12-19; ວັນຈົດທະບຽນ/ອະນຸຍາດ 2025-04-25; ວັນໝົດອາຍຸ 2040-07-03. ປະເພດ/ຫ້ອງ: B24B 37/08、B24B 49/10、B24B 49/16、H01L 21/304. ນັກປະດິດ/ນັກອອກແບບ: FUJII Hirofumi, KITAMOTO Hideo, SHIOMICHI Yukimasa, SUGIMURA OsaMU. ສະຫຼຸບ: The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a metho…. ຂໍ້ມູນເພື່ອອ້າງອີງເທົ່ານັ້ນ ບໍ່ແມ່ນຄຳແນະນຳທາງກົດໝາຍ ຫຼື ໃບຢັ້ງຢືນສິດ.

专利 老挝 DIP

申请号 P/818
申请日期 2020-07-03
注册/授权日 2025-04-25
申请人 TOYO KOHAN CO., LTD
代理机构 Tilleke & Gibbins Lao Co., Ltd
类别 B24B 37/08 · B24B 49/10 · B24B 49/16 · H01L 21/304

图样

下载

基础信息

类型
专利
申请号
P/818
状态
已注册
申请人
TOYO KOHAN CO., LTD
代理机构
Tilleke & Gibbins Lao Co., Ltd
申请日期
2020-07-03
注册号
P/818
公开/公告日
2025-12-19
注册/授权日
2025-04-25
届满日
2040-07-03
国际分类
B24B 37/08 · B24B 49/10 · B24B 49/16 · H01L 21/304
商品 / 服务

办理流程

根据当前状态动态标注
  1. 提交申请
  2. 形式审查
  3. 实质审查
  4. 公开
  5. 授权

关联分析

LaoBiz 企业数据库联动

摘要

The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a method for producing a substrate with which it is possible to quickly control the flatness of a substrate with a high degree of precision by controlling polishing conditions. The present invention is a control system of a double-sided polishing device 10 that sandwiches a body W to be polished between an upper face plate 21 and a lower face plate 32 and that polishes a TOP surface 30a and a BOT surface 30b of the body W to be polished by causing the upper face plate and the lower face plate to rotate, wherein the control system is characterized in that: each of a TOP surface work amount PT (Ws) required in polishing of the TOP surface 30a, and a BOT surface work amount PB (Ws) required in polishing of the BOT surface 30b, are calculated; and polishing conditions are controlled so that the difference between the calculated TOP surface work amount PT and BOT surface work amount PB is kept within a prescribed range.

The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a method for producing a substrate with which it is possible to quickly control the flatness of a substrate with a high degree of precision by controlling polishing conditions. The present invention is a control system of a double-sided polishing device 10 that sandwiches a body W to be polished between an upper face plate 21 and a lower face plate 32 and that polishes a TOP surface 30a and a BOT surface 30b of the body W to be polished by causing the upper face plate and the lower face plate to rotate, wherein the control system is characterized in that: each of a TOP surface work amount PT (Ws) required in polishing of the TOP surface 30a, and a BOT surface work amount PB (Ws) required in polishing of the BOT surface 30b, are calculated; and polishing conditions are controlled so that the difference between the calculated TOP surface work amount PT and BOT surface work amount PB is kept within a prescribed range.

提交咨询

留下联系方式,顾问将在工作时间内回复。

联系方式 * 点选后填写 · 至少一种
验证码 *
验证码

登录 LaoBiz

使用注册邮箱登录您的账号

或使用

使用 Google 登录

还没有账号?

或使用

使用 Google 注册

已有账号?

该社交账号未提供邮箱,请填写常用邮箱并完成验证后即可登录。