CONTROL SYSTEM FOR DOUBLE-SIDE POLISHING APPARATUS, CONTROL APPARATUS, AND METHOD FOR PRODUCING SUBSTRATE
本页收录老挝专利「CONTROL SYSTEM FOR DOUBLE-SIDE POLISHING APPARATUS, CONTROL APPARATUS, AND METHOD FOR PRODUCING SUBSTRATE」的公开登记要点,由 TOYO KOHAN CO., LTD 于 2020-07-03 提交申请,当前状态为已注册。关键编号与类型标注为 申请号 P/818 / DIP 编号 LAP818 / 主管局代码 LA / 保护类型 Patent - PCT National Phase。时间线要点:公开/公告日 2025-12-19;授权日 2025-04-25;届满/失效参考日 2040-07-03。国际分类 / IPC 标注为 B24B 37/08、B24B 49/10、B24B 49/16、H01L 21/304。发明人 / 设计人包括 FUJII Hirofumi、KITAMOTO Hideo、SHIOMICHI Yukimasa、SUGIMURA OsaMU。代理机构 / 代理人记载为 Tilleke & Gibbins Lao Co., Ltd。公开摘要提示:The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a metho…。
The following summary describes a Laos Patent titled “CONTROL SYSTEM FOR DOUBLE-SIDE POLISHING APPARATUS, CONTROL APPARATUS, AND METHOD FOR PRODUCING SUBSTRATE”, filed by TOYO KOHAN CO., LTD on 2020-07-03; current status: Registered. Identifiers include application No. P/818; DIP id LAP818; protection kind Patent - PCT National Phase. Key dates: publication 2025-12-19; grant 2025-04-25; expiry reference 2040-07-03. Classification: B24B 37/08、B24B 49/10、B24B 49/16、H01L 21/304. Inventor(s)/designer(s): FUJII Hirofumi, KITAMOTO Hideo, SHIOMICHI Yukimasa, SUGIMURA OsaMU. Abstract hint: The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a metho…. This prose is informational only and does not constitute legal advice, ownership proof or an infringement opinion.
ໜ້ານີ້ສະຫຼຸບ ສິດທິບັດ «CONTROL SYSTEM FOR DOUBLE-SIDE POLISHING APPARATUS, CONTROL APPARATUS, AND METHOD FOR PRODUCING SUBSTRATE» ຈາກຂໍ້ມູນຈົດທະບຽນເປີດ, ຍື່ນໂດຍ TOYO KOHAN CO., LTD ໃນວັນທີ 2020-07-03; ສະຖານະ ຈົດທະບຽນແລ້ວ. ຕົວລະບຸ: ເລກທີຄຳຮ້ອງ P/818; ລະຫັດ DIP LAP818; ປະເພດການປົກປ້ອງ Patent - PCT National Phase. ວັນທີສຳຄັນ: ວັນເຜີຍແຜ່ 2025-12-19; ວັນຈົດທະບຽນ/ອະນຸຍາດ 2025-04-25; ວັນໝົດອາຍຸ 2040-07-03. ປະເພດ/ຫ້ອງ: B24B 37/08、B24B 49/10、B24B 49/16、H01L 21/304. ນັກປະດິດ/ນັກອອກແບບ: FUJII Hirofumi, KITAMOTO Hideo, SHIOMICHI Yukimasa, SUGIMURA OsaMU. ສະຫຼຸບ: The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a metho…. ຂໍ້ມູນເພື່ອອ້າງອີງເທົ່ານັ້ນ ບໍ່ແມ່ນຄຳແນະນຳທາງກົດໝາຍ ຫຼື ໃບຢັ້ງຢືນສິດ.
P/818
图样
基础信息
- 类型
- 专利
- 申请号
P/818- 状态
- 已注册
- 申请人
- TOYO KOHAN CO., LTD
- 代理机构
- Tilleke & Gibbins Lao Co., Ltd
- 申请日期
- 2020-07-03
- 注册号
P/818- 公开/公告日
- 2025-12-19
- 注册/授权日
- 2025-04-25
- 届满日
- 2040-07-03
- 国际分类
- B24B 37/08 · B24B 49/10 · B24B 49/16 · H01L 21/304
- 商品 / 服务
- —
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摘要
The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a method for producing a substrate with which it is possible to quickly control the flatness of a substrate with a high degree of precision by controlling polishing conditions. The present invention is a control system of a double-sided polishing device 10 that sandwiches a body W to be polished between an upper face plate 21 and a lower face plate 32 and that polishes a TOP surface 30a and a BOT surface 30b of the body W to be polished by causing the upper face plate and the lower face plate to rotate, wherein the control system is characterized in that: each of a TOP surface work amount PT (Ws) required in polishing of the TOP surface 30a, and a BOT surface work amount PB (Ws) required in polishing of the BOT surface 30b, are calculated; and polishing conditions are controlled so that the difference between the calculated TOP surface work amount PT and BOT surface work amount PB is kept within a prescribed range.
The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a method for producing a substrate with which it is possible to quickly control the flatness of a substrate with a high degree of precision by controlling polishing conditions. The present invention is a control system of a double-sided polishing device 10 that sandwiches a body W to be polished between an upper face plate 21 and a lower face plate 32 and that polishes a TOP surface 30a and a BOT surface 30b of the body W to be polished by causing the upper face plate and the lower face plate to rotate, wherein the control system is characterized in that: each of a TOP surface work amount PT (Ws) required in polishing of the TOP surface 30a, and a BOT surface work amount PB (Ws) required in polishing of the BOT surface 30b, are calculated; and polishing conditions are controlled so that the difference between the calculated TOP surface work amount PT and BOT surface work amount PB is kept within a prescribed range.