CONTROL SYSTEM FOR DOUBLE-SIDE POLISHING APPARATUS, CONTROL APPARATUS, AND METHOD FOR PRODUCING SUBSTRATE
ໜ້ານີ້ສະຫຼຸບ ສິດທິບັດ «CONTROL SYSTEM FOR DOUBLE-SIDE POLISHING APPARATUS, CONTROL APPARATUS, AND METHOD FOR PRODUCING SUBSTRATE» ຈາກຂໍ້ມູນຈົດທະບຽນເປີດ, ຍື່ນໂດຍ TOYO KOHAN CO., LTD ໃນວັນທີ 2020-07-03; ສະຖານະ ຈົດທະບຽນແລ້ວ. ຕົວລະບຸ: ເລກທີຄຳຮ້ອງ P/818; ລະຫັດ DIP LAP818; ປະເພດການປົກປ້ອງ Patent - PCT National Phase. ວັນທີສຳຄັນ: ວັນເຜີຍແຜ່ 2025-12-19; ວັນຈົດທະບຽນ/ອະນຸຍາດ 2025-04-25; ວັນໝົດອາຍຸ 2040-07-03. ປະເພດ/ຫ້ອງ: B24B 37/08、B24B 49/10、B24B 49/16、H01L 21/304. ນັກປະດິດ/ນັກອອກແບບ: FUJII Hirofumi, KITAMOTO Hideo, SHIOMICHI Yukimasa, SUGIMURA OsaMU. ສະຫຼຸບ: The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a metho…. ຂໍ້ມູນເພື່ອອ້າງອີງເທົ່ານັ້ນ ບໍ່ແມ່ນຄຳແນະນຳທາງກົດໝາຍ ຫຼື ໃບຢັ້ງຢືນສິດ.
P/818
ຮູບໝາຍ
ຂໍ້ມູນພື້ນຖານ
- ປະເພດ
- ສິດທິບັດ
- ເລກຄຳຮ້ອງ
P/818- ສະຖານະ
- ຈົດທະບຽນແລ້ວ
- ຜູ້ຮ້ອງຂໍ
- TOYO KOHAN CO., LTD
- ຕົວແທນ
- Tilleke & Gibbins Lao Co., Ltd
- ວັນຍື່ນ
- 2020-07-03
- ເລກທະບຽນ
P/818- ວັນເຜີຍແຜ່
- 2025-12-19
- ວັນຈົດທະບຽນ / ອະນຸຍາດ
- 2025-04-25
- ວັນໝົດອາຍຸ
- 2040-07-03
- ປະເພດການປົກປ້ອງ
- Patent - PCT National Phase
- ເລກທີຜ່ານຈົດໝາຍ
- 301 · 2025-04-25
- ບຸລິມະສິດ
- JP · 2019-124851 · 2019-07-03
- ທີ່ຢູ່ຜູ້ຍື່ນ
- TOYO KOHAN CO., LTD · 18-1, Higashi-Gotanda 2 Chome, Shinagawa-ku, Tokyo 1418260 JAPAN · JP
- ທີ່ຢູ່ຕົວແທນ
- Tilleke & Gibbins Lao Co., Ltd · No. 302, 3rd Floor, Vieng Vang Tower, Unit 15, Boulichan Road, Dongpalan Thong Village, Sisattanak District, Vientiane Capital, Lao PDR · LA
- ປະເພດສາກົນ
- B24B 37/08 · B24B 49/10 · B24B 49/16 · H01L 21/304
- ສິນຄ້າ / ບໍລິການ
- —
ຂັ້ນຕອນ
ໝາຍຕາມສະຖານະປັດຈຸບັນ-
ຍື່ນຄຳຮ້ອງ
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ກວດຮູບແບບ
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ກວດເນື້ອໃນ
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ເຜີຍແຜ່
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ອະນຸຍາດ
ການວິເຄາະກ່ຽວຂ້ອງ
ເຊື່ອມກັບຖານຂໍ້ມູນວິສາຫະກິດ LaoBiz.comສິດທິບັດທີ່ຄ້າຍກັນ
ສະຫລຸບ
The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a method for producing a substrate with which it is possible to quickly control the flatness of a substrate with a high degree of precision by controlling polishing conditions. The present invention is a control system of a double-sided polishing device 10 that sandwiches a body W to be polished between an upper face plate 21 and a lower face plate 32 and that polishes a TOP surface 30a and a BOT surface 30b of the body W to be polished by causing the upper face plate and the lower face plate to rotate, wherein the control system is characterized in that: each of a TOP surface work amount PT (Ws) required in polishing of the TOP surface 30a, and a BOT surface work amount PB (Ws) required in polishing of the BOT surface 30b, are calculated; and polishing conditions are controlled so that the difference between the calculated TOP surface work amount PT and BOT surface work amount PB is kept within a prescribed range.
The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a method for producing a substrate with which it is possible to quickly control the flatness of a substrate with a high degree of precision by controlling polishing conditions. The present invention is a control system of a double-sided polishing device 10 that sandwiches a body W to be polished between an upper face plate 21 and a lower face plate 32 and that polishes a TOP surface 30a and a BOT surface 30b of the body W to be polished by causing the upper face plate and the lower face plate to rotate, wherein the control system is characterized in that: each of a TOP surface work amount PT (Ws) required in polishing of the TOP surface 30a, and a BOT surface work amount PB (Ws) required in polishing of the BOT surface 30b, are calculated; and polishing conditions are controlled so that the difference between the calculated TOP surface work amount PT and BOT surface work amount PB is kept within a prescribed range.
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