CONTROL SYSTEM FOR DOUBLE-SIDE POLISHING APPARATUS, CONTROL APPARATUS, AND METHOD FOR PRODUCING SUBSTRATE
专利「CONTROL SYSTEM FOR DOUBLE-SIDE POLISHING APPARATUS, CONTROL APPARATUS, AND METHOD FOR PRODUCING SUBSTRATE」由 TOYO KOHAN CO., LTD 持有，当前状态为已注册，申请号 P/818。LaoBiz 老商通提供老挝知识产权信息检索与企业关联查询。
Patent “CONTROL SYSTEM FOR DOUBLE-SIDE POLISHING APPARATUS, CONTROL APPARATUS, AND METHOD FOR PRODUCING SUBSTRATE” is held by TOYO KOHAN CO., LTD; status: 已注册. Search Laos IP records on LaoBiz.
P/818
图样
基础信息
- 类型
- 专利
- 申请号
P/818- 状态
- 已注册
- 申请人
- TOYO KOHAN CO., LTD
- 代理机构
- Tilleke & Gibbins Lao Co., Ltd
- 申请日期
- 2020-07-03
- 注册号
P/818- 公开/公告日
- 2025-12-19
- 注册/授权日
- 2025-04-25
- 届满日
- 2040-07-03
- 国际分类
- B24B 37/08 · B24B 49/10 · B24B 49/16 · H01L 21/304
- 商品 / 服务
- —
办理流程
根据当前状态动态标注-
提交申请
-
形式审查
-
实质审查
-
公开
-
授权
关联分析
LaoBiz 企业数据库联动类似专利推荐
摘要
The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a method for producing a substrate with which it is possible to quickly control the flatness of a substrate with a high degree of precision by controlling polishing conditions. The present invention is a control system of a double-sided polishing device 10 that sandwiches a body W to be polished between an upper face plate 21 and a lower face plate 32 and that polishes a TOP surface 30a and a BOT surface 30b of the body W to be polished by causing the upper face plate and the lower face plate to rotate, wherein the control system is characterized in that: each of a TOP surface work amount PT (Ws) required in polishing of the TOP surface 30a, and a BOT surface work amount PB (Ws) required in polishing of the BOT surface 30b, are calculated; and polishing conditions are controlled so that the difference between the calculated TOP surface work amount PT and BOT surface work amount PB is kept within a prescribed range.
The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a method for producing a substrate with which it is possible to quickly control the flatness of a substrate with a high degree of precision by controlling polishing conditions. The present invention is a control system of a double-sided polishing device 10 that sandwiches a body W to be polished between an upper face plate 21 and a lower face plate 32 and that polishes a TOP surface 30a and a BOT surface 30b of the body W to be polished by causing the upper face plate and the lower face plate to rotate, wherein the control system is characterized in that: each of a TOP surface work amount PT (Ws) required in polishing of the TOP surface 30a, and a BOT surface work amount PB (Ws) required in polishing of the BOT surface 30b, are calculated; and polishing conditions are controlled so that the difference between the calculated TOP surface work amount PT and BOT surface work amount PB is kept within a prescribed range.