专利 已注册

CONTROL SYSTEM FOR DOUBLE-SIDE POLISHING APPARATUS, CONTROL APPARATUS, AND METHOD FOR PRODUCING SUBSTRATE

Overview

本页收录老挝专利「CONTROL SYSTEM FOR DOUBLE-SIDE POLISHING APPARATUS, CONTROL APPARATUS, AND METHOD FOR PRODUCING SUBSTRATE」的公开登记要点,由 TOYO KOHAN CO., LTD 于 2020-07-03 提交申请,当前状态为已注册。关键编号与类型标注为 申请号 P/818 / DIP 编号 LAP818 / 主管局代码 LA / 保护类型 Patent - PCT National Phase。时间线要点:公开/公告日 2025-12-19;授权日 2025-04-25;届满/失效参考日 2040-07-03。国际分类 / IPC 标注为 B24B 37/08、B24B 49/10、B24B 49/16、H01L 21/304。发明人 / 设计人包括 FUJII Hirofumi、KITAMOTO Hideo、SHIOMICHI Yukimasa、SUGIMURA OsaMU。代理机构 / 代理人记载为 Tilleke & Gibbins Lao Co., Ltd。公开摘要提示:The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a metho…。

专利 老挝 DIP

申请号 P/818
申请日期 2020-07-03
注册/授权日 2025-04-25
申请人 TOYO KOHAN CO., LTD
代理机构 Tilleke & Gibbins Lao Co., Ltd
类别 B24B 37/08 · B24B 49/10 · B24B 49/16 · H01L 21/304

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基础信息

类型
专利
申请号
P/818
状态
已注册
申请人
TOYO KOHAN CO., LTD
代理机构
Tilleke & Gibbins Lao Co., Ltd
申请日期
2020-07-03
注册号
P/818
公开/公告日
2025-12-19
注册/授权日
2025-04-25
届满日
2040-07-03
国际分类
B24B 37/08 · B24B 49/10 · B24B 49/16 · H01L 21/304
商品 / 服务

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根据当前状态动态标注
  1. 提交申请
  2. 形式审查
  3. 实质审查
  4. 公开
  5. 授权

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摘要

The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a method for producing a substrate with which it is possible to quickly control the flatness of a substrate with a high degree of precision by controlling polishing conditions. The present invention is a control system of a double-sided polishing device 10 that sandwiches a body W to be polished between an upper face plate 21 and a lower face plate 32 and that polishes a TOP surface 30a and a BOT surface 30b of the body W to be polished by causing the upper face plate and the lower face plate to rotate, wherein the control system is characterized in that: each of a TOP surface work amount PT (Ws) required in polishing of the TOP surface 30a, and a BOT surface work amount PB (Ws) required in polishing of the BOT surface 30b, are calculated; and polishing conditions are controlled so that the difference between the calculated TOP surface work amount PT and BOT surface work amount PB is kept within a prescribed range.

The present invention addresses the problem of providing a control system of a double-sided polishing device, a control device, and a method for producing a substrate with which it is possible to quickly control the flatness of a substrate with a high degree of precision by controlling polishing conditions. The present invention is a control system of a double-sided polishing device 10 that sandwiches a body W to be polished between an upper face plate 21 and a lower face plate 32 and that polishes a TOP surface 30a and a BOT surface 30b of the body W to be polished by causing the upper face plate and the lower face plate to rotate, wherein the control system is characterized in that: each of a TOP surface work amount PT (Ws) required in polishing of the TOP surface 30a, and a BOT surface work amount PB (Ws) required in polishing of the BOT surface 30b, are calculated; and polishing conditions are controlled so that the difference between the calculated TOP surface work amount PT and BOT surface work amount PB is kept within a prescribed range.

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