MANUFACTURING METHOD OF HARD DISK SUBSTRATE
This Laos Patent “MANUFACTURING METHOD OF HARD DISK SUBSTRATE” is a public DIP intellectual-property record, filed by TOYO KOHAN CO., LTD. on 2020-02-14; current status: Registered. Identifiers include application No. P/797; DIP id LAP797; protection kind Patent - PCT National Phase. Key dates: publication 2025-02-21; grant 2025-02-20; expiry reference 2040-02-14. Classification: B24B 49/02、B24B 49/10、G11B 5/84. Inventor(s)/designer(s): HAYASHI Junichi. Abstract hint: A production method for a hard disk board 10. The production method: makes it possible to achieve high-precision polishing by quickly selec…. Status labels may change after office actions; refresh or consult primary DIP data before commercial decisions.
P/797
Mark
Key facts
- Type
- Patent
- App. no.
P/797- Status
- Registered
- Applicant
- TOYO KOHAN CO., LTD.
- Agent
- Tilleke & Gibbins International Ltd
- Filing date
- 2020-02-14
- Reg. no.
P/797- Publication
- 2025-02-21
- Registration / grant
- 2025-02-20
- Expiry
- 2040-02-14
- Protection kind
- Patent - PCT National Phase
- Gazette
- 292 · 2025-02-21
- Priority
- JP · 2019-026110 · 2019-02-15
- Applicant address
- TOYO KOHAN CO., LTD. · 18-1, Higashi-Gotanda 2 Chome, Shinagawa-ku, Toky 1418260 JAPAN · JP
- Agent address
- Tilleke & Gibbins International Ltd · No. 302/1B, 3rd Floor, Vieng Vang Tower, Unit 15, Boulichan Road, Dongpalan Thong Village, Sisattanak District, Vientiane Capital, Lao PDR · LA
- Nice / IPC classes
- B24B 49/02 · B24B 49/10 · G11B 5/84
- Goods / services
- —
Process
Steps follow the current public status-
Filed
-
Formal examination
-
Substantive examination
-
Published
-
Granted
Related records
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Abstract
A production method for a hard disk board 10. The production method: makes it possible to achieve high-precision polishing by quickly selecting to change polishing conditions or replace a polishing pad on the basis of the flatness of the hard disk board 10; and suppresses the occurrence of defects in the hard disk board 10. The production method includes: a polishing step (S21) in which the hard disk board 10 is polished; a polished flatness measurement step (S24) in which the polished flatness of the hard disk board is measured; a polished flatness determination step (S41) in which the trend in the polished flatness of the hard disk board is calculated from the results of the measurement, and it is determined whether the trend in the polished flatness meets a 1A standard; and a polishing adjustment step (S25) in which, on condition that the trend in the polished flatness does not meet the 1A standard, it is determined (S42) whether changing the polishing conditions of the polishing step would make the trend in the polished flatness meet a 1C standard, and, on the basis of the results of the determination of whether the 1C standard would be met, the polishing conditions are changed (S43) or a polishing pad is replaced (S44).
A production method for a hard disk board 10. The production method: makes it possible to achieve high-precision polishing by quickly selecting to change polishing conditions or replace a polishing pad on the basis of the flatness of the hard disk board 10; and suppresses the occurrence of defects in the hard disk board 10. The production method includes: a polishing step (S21) in which the hard disk board 10 is polished; a polished flatness measurement step (S24) in which the polished flatness of the hard disk board is measured; a polished flatness determination step (S41) in which the trend in the polished flatness of the hard disk board is calculated from the results of the measurement, and it is determined whether the trend in the polished flatness meets a 1A standard; and a polishing adjustment step (S25) in which, on condition that the trend in the polished flatness does not meet the 1A standard, it is determined (S42) whether changing the polishing conditions of the polishing step would make the trend in the polished flatness meet a 1C standard, and, on the basis of the results of the determination of whether the 1C standard would be met, the polishing conditions are changed (S43) or a polishing pad is replaced (S44).
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