商标 已注册

e elvia electronics

老挝商标「e elvia electronics」是 DIP 公开可查的知识产权档案,由 ELVIA Printed Circuit Boards 于 2024-12-03 提交申请,当前状态为已注册。关键编号与类型标注为 申请号 M/1853507 / 注册/授权号 67149 / DIP 编号 LAM1853507 / 主管局代码 LA / 申请类型 Other。时间线要点:公开/公告日 2025-09-08;注册日 2026-02-12。尼斯分类覆盖第 10、42、35、9 类。商品与服务说明摘录:Medical apparatus and instruments; testing apparatus for medical use; medical instruments for use on the huma…。代理机构 / 代理人记载为 Monsieur HERPE François CORNET VINCENT SEGUREL。以上文字由独有申请标识与状态字段拼接而成,供检索与尽调线索使用;状态可能随 DIP 更新变化,请以主管部门最新数据为准。

商标 老挝 DIP

申请号 M/1853507
申请日期 2024-12-03
注册 / 授权日 2026-02-12
申请人 ELVIA Printed Circuit Boards
代理机构 Monsieur HERPE François CORNET VINCENT SEGUREL
类别 10 · 42 · 35 · 9

图样

基础信息

类型
商标
申请号
M/1853507
状态
已注册
申请人
ELVIA Printed Circuit Boards
代理机构
Monsieur HERPE François CORNET VINCENT SEGUREL
申请日期
2024-12-03
注册号
67149
公开 / 公告日
2025-09-08
注册 / 授权日
2026-02-12
国际分类
10 · 42 · 35 · 9
商品 / 服务
  • Medical apparatus and instruments; testing apparatus for medical use; medical instruments for use on the human body; medical instruments for use in the human body; medical diagnostic instruments; detectors for medical applications; electronic apparatus for medical use; electronic monitors for medical use; programmers [medical apparatus] for medical use; medical instruments for recording heart activity.
  • Designing and co-designing printed circuits; design of printed material; design of integrated circuits; design of electrical circuit boards; design of prototypes; technical consultant services for circuit co-conception, co-design and problem-solving and technical planning and construction of printed circuits, electronic assemblies, electronic parts, electronic component connections, electronic component media and electronic connection techniques; technical assessments concerning design (engineering work); surveying [engineering work]; testing of materials; scientific research; technical research; technological research; research and development of new products for third parties; developing electric and electronic parts, components, modules and devices; consultant services with respect to the development and production of the aforesaid components; scientific and technological services, as well as research with respect to the design of printed circuit boards; conducting of technical project studies; design office and engineering services; engineering services, in particular technical consult services relating to the installation and maintenance of software for use in manufacturing, processing of electric and electronic circuits, printed circuit boards, semiconductor components namely conducting technical measurements, technical trials and technical inspections; quality control; advice regarding information technology; technological consultancy services; industrial design services; technical writing; all the aforesaid services are in connection with the following products: electric and electronic circuits and circuit boards, semiconductor elements, semiconductor devices, engraved, chemically machined, pressed, press-cut, or printed circuits and electronic assemblies and electric and electronic components, connections for electric and electronic components, electric and electronic component carriers and electric and electronic connection techniques, electric conductors, accessories and spare parts for the aforesaid products, processing electric and electronic circuits.
  • Commercial business management; commercial administration; procurement services for third parties (purchasing electric and electronic components); commercial intermediation services.
  • Electric, electromechanical and electronic apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; etching apparatus; Testing apparatus for printed circuits; software for use in the manufacture, processing of electrical and electronic circuits and semiconductor components, printed circuit boards for connecting and/or transporting electrical and electronic assemblies, components, elements and/or modules; printed circuit boards; printed circuits; medical printed circuits; printed circuits for specific applications; multilayer printed circuits; flexible printed circuits; flexible printed circuit boards; circuit boards in the nature of substrates; plug-in printed circuits; electric and electronic circuits and circuit boards, all included printed circuit technology; integrated circuits; integrated circuits for specific applications; electronic circuits; printed electronic circuits; circuit boards provided with integrated circuits; electric collectors; electric conductors; electric contacts; boards for integrated circuits; electronic circuit boards; copper plates for printed circuits; integrated circuit modules; integrated circuit memories; electronic components [chips]; electric circuit components; circulators [electric or electronic components]; electronic components for integrated circuit cards; chips [integrated circuits]; electric relays; control circuit boards; electronic circuits containing programmed data; interface cards for data processing apparatus in the form of printed circuits; photolithographic equipment for semiconductors; substrates being semiconductor carriers; semiconductor elements and engraved, chemically machined, pressed, press-cut electronic cards, printed electric circuit boards; connections for electric and electronic components; electric and electronic component carriers; electric and electronic connectors; sub-components of electric batteries, battery power supply and battery measurement; parts and sub-parts for all the aforesaid goods; accessories and replacement parts for the aforesaid goods.

办理流程

根据当前状态动态标注
  1. 提交申请
  2. 形式审查
  3. 实质审查
  4. 公告
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