CARRIER AND SUBSTRATE MANUFACTURING METHOD USING THIS CARRIER
This Laos Patent “CARRIER AND SUBSTRATE MANUFACTURING METHOD USING THIS CARRIER” is a public DIP intellectual-property record, filed by HOYA CORPORATION on 2017-03-31; current status: Awaiting formal examination. Identifiers include application No. P/611; DIP id LAP611; protection kind Patent - PCT National Phase. Key dates: publication 2025-12-19. Classification: B24B 37/28、B24B 41/06、B24B 7/17、H01L 21/304. Inventor(s)/designer(s): HOYA LAMPHUN LTD., Jaknarin PROMCHAI. Abstract hint: [Problem] To provide a carrier which make it possible to obtain a high-quality substiare at a. This prose is informational only and does not constitute legal advice, ownership proof or an infringement opinion.
P/611
Mark
Key facts
- Type
- Patent
- App. no.
P/611- Status
- Awaiting formal examination
- Applicant
- HOYA CORPORATION
- Agent
- Tilleke & Gibbins Lao Co., Ltd
- Filing date
- 2017-03-31
- Publication
- 2025-12-19
- Protection kind
- Patent - PCT National Phase
- Priority
- JP · 2016-073512 · 2016-03-31；JP · 2016-073513 · 2016-03-31
- Applicant address
- HOYA CORPORATION · 6-10-l Nishi-Shinjuku, Shinjuku-ku, Tokyo 1608347 JAPAN · JP
- Agent address
- Tilleke & Gibbins Lao Co., Ltd · No. 302/1B, 3rd Floor, Vieng Vang Tower, Unit 15, Boulichan Road, Dongpalan Thong Village, Sisattanak District, Vientiane Capital, Lao PDR · LA
- Nice / IPC classes
- B24B 37/28 · B24B 41/06 · B24B 7/17 · H01L 21/304
- Goods / services
- —
Process
Steps follow the current public status-
Filed
-
Formal examination In progress
-
Substantive examination
-
Published
-
Granted
Related records
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Abstract
[Problem] To provide a carrier which make it possible to obtain a high-quality substiare at a
higher yield than conventional ones and a substrate manu-factuing method usiug his carrier. [Solutio] A carier 104 accordilg to the present invenlion is a carrier for pol-ishing or grindiog having a holding hole 122 for holding a substrate (for example, a glass substrate102). The carier is characterized in that a pluality of proEusioos 136 having glass as a main componeol ale preseat in at least a parlial
region of at least one surace of the carrier
[Problem] To provide a carrier which make it possible to obtain a high-quality substiare at a
higher yield than conventional ones and a substrate manu-factuing method usiug his carrier. [Solutio] A carier 104 accordilg to the present invenlion is a carrier for pol-ishing or grindiog having a holding hole 122 for holding a substrate (for example, a glass substrate102). The carier is characterized in that a pluality of proEusioos 136 having glass as a main componeol ale preseat in at least a parlial
region of at least one surace of the carrier
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