Trademark Registered

Samsung Nanoa

This Laos Trademark “Samsung Nanoa” is a public DIP intellectual-property record, filed by Samsung Electronics Co., Ltd. on 2025-03-28; current status: Registered. Identifiers include application No. M/1862891; registration/grant No. 67809; DIP id LAM1862891; application type Other. Key dates: publication 2025-09-08; registration 2026-05-12. Nice class(es): 42、9. Goods/services excerpt: Application service provider (ASP) featuring software using generative artificial intelligence (AI) for use i…. LaoBiz.com links this right to company TIN 342300651000 where a match is available. Status labels may change after office actions; refresh or consult primary DIP data before commercial decisions.

Trademark Laos DIP Linked company

App. no. M/1862891
Filing date 2025-03-28
Registration / grant 2026-05-12
Agent SELIM INTELLECTUAL PROPERTY LAW FIRM
Classes 42 · 9

Mark

Key facts

Type
Trademark
App. no.
M/1862891
Status
Registered
Agent
SELIM INTELLECTUAL PROPERTY LAW FIRM
Filing date
2025-03-28
Reg. no.
67809
Publication
2025-09-08
Registration / grant
2026-05-12
Nice / IPC classes
42 · 9
Goods / services
  • Application service provider (ASP) featuring software using generative artificial intelligence (AI) for use in providing information regarding semiconductors and the semiconductor sector; Software as a service (SAAS) services featuring software using generative artificial intelligence (AI) for use in providing information regarding semiconductors and the semiconductor sector; providing a website featuring non-downloadable software using generative artificial intelligence (AI) for use in providing information regarding semiconductors and the semiconductor sector; providing temporary use of on-line non-downloadable cloud computing software using generative artificial intelligence (AI) for use in providing information regarding semiconductors and the semiconductor sector; providing on-line non-downloadable software using generative artificial intelligence (AI) for use in providing information regarding semiconductors and the semiconductor sector; providing temporary use of online non-downloadable chatbot software using artificial intelligence (AI) for use in providing information regarding semiconductors and the semiconductor sector.
  • Downloadable computer software using generative artificial intelligence (AI) for providing information regarding semiconductors and the semiconductor sector; recorded computer software using generative artificial intelligence (AI) for providing information regarding semiconductors and the semiconductor sector; downloadable chatbot software using artificial intelligence (AI) for providing information from searchable indexes and databases of information, including text, music, images, videos, and databases in the semiconductor sector; downloadable computer software for facilitating interaction and communication between humans and artificial intelligence (AI) chatbots regarding semiconductors and the semiconductor sector; downloadable chatbot software for simulating conversations, analyzing text, images, sound and video, summarizing text, creating content, brainstorming, and answering queries regarding semiconductors and the semiconductor sector; recorded chatbot software using artificial intelligence (AI) for providing information from searchable indexes and databases of information, including text, music, images, videos, and databases in the semiconductor sector; recorded computer software for facilitating interaction and communication between humans and artificial intelligence (AI) chatbots regarding semiconductors and the semiconductor sector; recorded chatbot software for simulating conversations, analyzing text, images, sound and video, summarizing text, creating content, brainstorming, and answering queries regarding semiconductors and the semiconductor sector; semiconductors; dynamic random access memory (DRAM); solid state drives; semi-conductor memory units; blank USB flash drives; blank flash memory cards; semi-conductor memories; computer memory devices; microprocessors; multiprocessor chips; data processors; optical sensors; CMOS sensors; Complementary Metal-Oxide Semiconductor (CMOS) image sensor; camera image sensors for smartphones; automobile image sensors by complementary metal oxide semiconductor (CMOS); image sensors for photographic devices; time-of-flight (TOF) sensors; integrated circuits; light emitting diodes (leds).

Process

Steps follow the current public status
  1. Filed
  2. Formal examination
  3. Substantive examination
  4. Gazetted
  5. Registered

Related records

Linked from the LaoBiz.com company database

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