Trademark Registered

HONOR C1

This Laos Trademark “HONOR C1” is a public DIP intellectual-property record, filed by Honor Device Co., Ltd. on 2022-10-21; current status: Registered. Identifiers include application No. M/1698453; registration/grant No. 57560; DIP id LAM1698453; application type Other. Key dates: publication 2022-12-09; registration 2023-07-12. Nice class(es): 9. Goods/services excerpt: Data processing apparatus; computer peripheral devices; downloadable software applications for mobile phones…. Use LaoBiz.com to hop between this IP record, related filings by the same applicant, and the matched company profile when present.

Trademark Laos DIP

App. no. M/1698453
Filing date 2022-10-21
Registration / grant 2023-07-12
Applicant Honor Device Co., Ltd.
Agent Chofn Intellectual Property
Classes 9

Mark

Key facts

Type
Trademark
App. no.
M/1698453
Status
Registered
Applicant
Honor Device Co., Ltd.
Agent
Chofn Intellectual Property
Filing date
2022-10-21
Reg. no.
57560
Publication
2022-12-09
Registration / grant
2023-07-12
Nice / IPC classes
9
Goods / services
  • [9] Data processing apparatus; computer peripheral devices; downloadable software applications for mobile phones; computer software, recorded; microprocessors; processors [central processing units]; integrated circuit cards [smart cards]; notebook computers; tablet computers; smart glasses; smart watches; smart rings; chip cards; microchip cards; chip card readers; facial recognition apparatus; bathroom scales; smartphones; network communication apparatus; navigational instruments; global positioning system [GPS] apparatus; network routers; wearable activity trackers; cabinets for loudspeakers; television apparatus; headphones; car video recorders; cameras [photography]; sensors; DNA chips; integrated chip (IC) voice recorders; surveying apparatus and instruments; connected bracelets [measuring instruments]; semiconductor chips; computer chips; computer chipsets; microchips; multiprocessor chips; microchips [computer hardware]; HD integrated graphics chip; biochip sensors; electronic chips for the manufacture of integrated circuits; chips [integrated circuits]; electronic chips; digital door locks; biometric fingerprint door locks; 3D spectacles; portable power supplies (rechargeable batteries); smart cards [integrated circuit cards].

Process

Steps follow the current public status
  1. Filed
  2. Formal examination
  3. Substantive examination
  4. Gazetted
  5. Registered

Related records

Linked from the LaoBiz.com company database

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