SPACER, LAMINATE OF SUBSTRATES, SUBSTRATE PRODUCTION METHOD, AND METHOD FOR PRODUCING SUBSTRATE FOR MAGNETIC DISK
This Laos Patent “SPACER, LAMINATE OF SUBSTRATES, SUBSTRATE PRODUCTION METHOD, AND METHOD FOR PRODUCING SUBSTRATE FOR MAGNETIC DISK” is a public DIP intellectual-property record, filed by HOYA CORPORATION on 2019-03-11; current status: Abandoned. Identifiers include application No. P/714; DIP id LAP714; protection kind Patent - PCT National Phase. Key dates: publication 2026-02-20. Classification: B24B 41/06、B24B 9/00、G11B 5/84. Inventor(s)/designer(s): TAKANO, Masao. Abstract hint: The area of a spacer that is to be provided between the adjacent substrates in a laminate including a plurality of substrates to keep the a…. Unique application identifiers, holders and classification text are surfaced here to reduce near-duplicate IP landing pages; always verify against the competent office.
P/714
Mark
Key facts
- Type
- Patent
- App. no.
P/714- Status
- Abandoned
- Applicant
- HOYA CORPORATION
- Agent
- Tilleke & Gibbins Lao Co.,Ltd
- Filing date
- 2019-03-11
- Publication
- 2026-02-20
- Protection kind
- Patent - PCT National Phase
- Priority
- JP · 2018-043362 · 2018-03-09
- Nice / IPC classes
- B24B 41/06 · B24B 9/00 · G11B 5/84
- Goods / services
- —
Process
Steps follow the current public status-
Filed
-
Formal examination Refused / terminated
-
Substantive examination
-
Published
-
Granted
Related records
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Abstract
The area of a spacer that is to be provided between the adjacent substrates in a laminate including a plurality of substrates to keep the adjacent 5 substrates apart from each other is smaller than those ofthe stacked substrates. When pressure is released to bring the laminate obtained by providing the spacers between the substrates from a pressed state in which 0.60 MPa of pressure is applied to the laminate in the stacking direction into a non-pressed state, an amount ofchange AW in thickness per spacer that is calculated from a 10 change in the thickness ofthe laminate due to the release of pressure is 30 pm or less.
The area of a spacer that is to be provided between the adjacent substrates in a laminate including a plurality of substrates to keep the adjacent 5 substrates apart from each other is smaller than those ofthe stacked substrates. When pressure is released to bring the laminate obtained by providing the spacers between the substrates from a pressed state in which 0.60 MPa of pressure is applied to the laminate in the stacking direction into a non-pressed state, an amount ofchange AW in thickness per spacer that is calculated from a 10 change in the thickness ofthe laminate due to the release of pressure is 30 pm or less.
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