Xtacking
「Xtacking」对应一条老挝商标公开记录,由 Yangtze Memory Technologies Co., Ltd. 于 2025-08-18 提交申请,当前状态为等待形式审查。公开档案中可核验:申请号 M/1888999,DIP 编号 LAM1888999,主管局代码 LA,申请类型 Other。时间线要点:公开/公告日 2025-12-12。商品/服务类别(Nice)标注为 40、9。商品与服务说明摘录:Metal treating; pattern printing; recycling of waste and trash; encapsulation of semiconductors for others; e…。代理机构 / 代理人记载为 BEIJING PAT INTELLECTUAL PROPERTY OFFICE。LaoBiz 将商标、专利与外观设计公开字段整理为可读摘要,并尽量降低页间样板重复;不做权属或侵权结论。
The following summary describes a Laos trademark titled “Xtacking”, filed by Yangtze Memory Technologies Co., Ltd. on 2025-08-18; current status: Awaiting formal examination. Identifiers include application No. M/1888999; DIP id LAM1888999; application type Other. Key dates: publication 2025-12-12. Nice class(es): 40、9. Goods/services excerpt: Metal treating; pattern printing; recycling of waste and trash; encapsulation of semiconductors for others; e…. This prose is informational only and does not constitute legal advice, ownership proof or an infringement opinion.
ໜ້ານີ້ສະຫຼຸບ ເຄື່ອງໝາຍການຄ້າ «Xtacking» ຈາກຂໍ້ມູນຈົດທະບຽນເປີດ, ຍື່ນໂດຍ Yangtze Memory Technologies Co., Ltd. ໃນວັນທີ 2025-08-18; ສະຖານະ ລໍຖ້າກວດຮູບແບບ. ຕົວລະບຸ: ເລກທີຄຳຮ້ອງ M/1888999; ລະຫັດ DIP LAM1888999. ວັນທີສຳຄັນ: ວັນເຜີຍແຜ່ 2025-12-12. ປະເພດ/ຫ້ອງ: 40、9. ສິນຄ້າ/ບໍລິການ: Metal treating; pattern printing; recycling of waste and trash; encapsulation of semiconductors for others; e…. ຂໍ້ມູນເພື່ອອ້າງອີງເທົ່ານັ້ນ ບໍ່ແມ່ນຄຳແນະນຳທາງກົດໝາຍ ຫຼື ໃບຢັ້ງຢືນສິດ.
M/1888999
图样
基础信息
- 类型
- 商标
- 申请号
M/1888999- 状态
- 等待形式审查
- 申请人
- Yangtze Memory Technologies Co., Ltd.
- 代理机构
- BEIJING PAT INTELLECTUAL PROPERTY OFFICE
- 申请日期
- 2025-08-18
- 公开/公告日
- 2025-12-12
- 国际分类
- 40 · 9
- 商品 / 服务
- Metal treating; pattern printing; recycling of waste and trash; encapsulation of semiconductors for others; encapsulation of semi-conductors; processing of semiconductor wafers; custom manufacture of semiconductor wafers; custom manufacture of semiconductor circuits; custom manufacturing of chips [integrated circuits] for others.
- Memory cards; computer software, recorded; semi-conductor memory units; solid state drives; USB flash drives; cases adapted for computers; mouse pads; electronic memories; downloadable application software for smartphones; semi-conductors; computer chips; electronic chips; chips [integrated circuits]; integrated circuits.
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